For making sound interconnections, the
characteristics and properties of the circuit board surface finish
are as important as the component leads and termination. Hot air
solder leveled SnPb (HASL) has been used successfully as the surface
finish for surface mount and mixed PCBs.
As the need of a flat surface with
uniform thickness becomes increasingly important to forming
consistent and reliable fine-pitch solder joints, the HASL process
often falls short.
Alternatives to HASL include immersion
Sn, electroplated SnPb (reflowed or nonreflowed), electroplated
Au/Ni, electroless Au/electroless Ni, immersion Au/ electroless Ni,
immersion Pd, immersion Pb/electroless Ni, electroplated Sn- Ni
alloy, and organic coating.
When selecting an alternative surface
finish for a PCB assembly, the key parameters to consider are
solderability, ambient stability, high-temperature stability,
suitability of the use as contact/switch surface, solder-joint
integrity, wire bondability of assemblies that involve wire bonding,
and cost.
Whatever its deficiencies may be, HASL
provides the most solderable surface. However, comparing a metallic
system with HASL, the latter subjects PCBs to higher temperatures
(above 200°C), producing inevitable thermal stress in PCBs.
Furthermore, HASL is not suitable for
wire bonding. To choose a valid replacement for HASL, many variables
need to be assessed. Understanding the fundamentals behind each
variable, in conjunction with setting proper priority of importance
among these variables for a specific application, is the way to reach
the best balanced solution.
When selecting an alternative surface
finish for PCB assembly, the key parameters to consider are
solderability, ambient stability, high temperature stability,
suitable for use as a contact/switch surface, solder-joint integrity,
and wire bondability for those assemblies that involve wire bonding,
and cost.
Table 5.14 summarizes the relative
performance of PCB surface finish systems.
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