The issue of lead in electronics has
gone through more than 12 years of deliberation and debate by
legislative bodies, manufacturers, and individuals around the world.
Various ideas have been exhibited, particularly in U.S., and
individual opinions expressed by both supporters and oppositions have
been eloquent.
On the global landscape, the tangible
progress in technology and legislation differs in the three major
continents—North America, the European Union, and Asia. Although a
uniform consensus is still to be worked out, the technology has
advanced, the business climate has changed, and, overall, the
marketplace is striding into a highly environmentally-conscious
playing field.
Various organizations have made
dedicated effort to inform the industry about this pivotal issue. For
instance, the Swedish Institute of Production Engineering Research
(IVF) has developed the “Electronics Design-for-Environment
Webguide,” which disseminates updated information to the industry
regarding the development of legislation and technology.
The International Tin Research
Institute (ITRI) launched the Lead-Free Soldering Technology Centre,
and IPC initiated the Lead Free Forum on the Internet. Professional
organizations such as Surface Mount Technology Association (SMTA) and
International Microelectronics and Packaging Society (IMAPS) have
organized symposia dedicated to disseminating knowledge and
information.
Global legislations in the three
regions are described separately, below. To producers and
manufacturers, waste reduction, recovery, and recycling should be and
inevitably will be treated as a long-term goal supported by an
ongoing effort.
A product should be designed for
minimal environmental impact and with the full life cycle in mind.
Life-cycle assessment includes all the energy and resource inputs to
a product, the associated wastes, and the resulting health and
ecological burdens. Overall the goal is to reduce environmental
impacts from cradle to grave.
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